Welcome Message
Welcome to the 2025 International Conference on Planarization/CMP Technology! This year the conference is held in Hong Kong, China on October 29th to November 1st at the Hong Kong Science & Technology Park. The conference is hosted by the Chinese Tribology Institute of the Chinese Mechanical Engineering Society and co-hosted by Tsinghua University. We are honored to organize the conference in China again, and hope that it will be a wonderful event.
ICPT is the world’s premier conference for scientific exchange focused on planarization, which is mainly chemical mechanical planarization (CMP). It represents the collaborative effort of CMP Users Groups from all six major semiconductor technology regions of the world. We are dedicated to fostering an open, inclusive, and innovative international discussion milieu, offering invaluable opportunities for exchange and collaboration among industry peers.
The conference will delve into a variety of cutting-edge subjects, such as FEOL and BEOL CMP, consumables and equipment, emerging and alternative CMP technologies. We are honored to have enlisted numerous premier speakers who will deliver captivating academic reports and offer unique perspectives. Additionally, the conference will showcase numerous oral presentations and a rich assortment of poster displays, presenting the latest research accomplishments and development tendencies in CMP technology.
For further details regarding the conference, attendance guidelines, and other information, please visit the conference website: www.icpt2025.org.
Finally, on behalf of the ICPT 2025 committee, we convey our most sincere gratitude and warmest welcome to you! Thank you for your contributions to the success of this conference. Let us collaborate to drive innovation and development in CMP technology and forge a splendid future!
Welcome to ICPT 2025 in Hong Kong, China!
Sincerely,
Xinchun Lu
Conference Chair
