Call for Abstracts
ICPT 2025 offers a premier platform for global academic researchers, industry professionals, and engineers to share the latest advancements in Chemical Mechanical Polishing (CMP) and other planarization technologies. We invite abstracts of original work covering a range of topics related to planarization, including:
- - FEOL CMP
- - BEOL CMP
- - Defects, reliability issues and Post CMP cleaning
- - CMP fundamentals, modeling and simulation
- - Equipment, process control and metrology
- - Emerging and alternative CMP technologies
- - CMP consumables
- - 3D ICs/TSV/packaging applications
- - CMP for MEMS and hybrid applications
- - Substrate polishing such as Si, SiC, GaN and Diamond
Information for Authors
The submitted manuscript must be original and not previously published. It should not be under review by any other journal or conference. Additionally, it must not violate any existing copyrights or the rights of third parties.
Abstracts
All abstracts must be submitted in English. For student papers, please select the appropriate option in the checkbox.
ICPT 2025 Abstract Template (504KB)Abstracts will be evaluated based on the originality and significance of the work, as well as the quality of the information and data presented. The ideal abstract will showcase innovative research in an area of importance to the industry and include supporting data to substantiate the conclusions.
When submitting your abstract, please indicate your preferred presentation format (oral or poster) and specify the targeted topic area.
