Call for Abstracts

ICPT 2025 offers a premier platform for global academic researchers, industry professionals, and engineers to share the latest advancements in Chemical Mechanical Polishing (CMP) and other planarization technologies. We invite abstracts of original work covering a range of topics related to planarization, including:

• - FEOL CMP
• - BEOL CMP
• - Defects, reliability issues and Post CMP cleaning
• - CMP fundamentals, modeling and simulation
• - Equipment, process control and metrology
• - Emerging and alternative CMP technologies
• - CMP consumables
• - 3D ICs/TSV/packaging applications
• - CMP for MEMS and hybrid applications
• - Substrate polish such as Si, SiC, GaN and Diamond