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Important Dates

Important Dates

May 31, 2025

Abstract submission deadline

Jun. 30, 2025

Notification of acceptance

Aug. 1, 2025

Early Bird Registration Deadline

Oct. 29-Nov. 1, 2025

ICPT Conference 2025

Organization

Sponsored by
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Chinese Mechanical Engineering Society (CMES)
Organized By
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Chinese Tribology Institute, CMES
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Tsinghua University
Co-organized By
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Hwatsing Technology Co.,Ltd.
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Anji Microelectronics Technology (Shanghai) Co., Ltd.
Supported By
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Hong Kong Applied Science & Technology Research institute (ASTRI)
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Shanghai University
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Fudan University
Contractor
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Beijing Xinxinyixiang International Conferences Co., Ltd. (Room 810, Floor 8, Block B, Xiaoyun Center, No.15 Xiaguangli, Beijing 100027, P.R. China) is commissioned to provide professional conference service for the ICPT2025.

Welcome Message

Welcome to the 2025 International Conference on Planarization/CMP Technology! This year the conference is held in Hong Kong, China on October 29th to November 1st at the Hong Kong Science & Technology Park. The conference is hosted by the Chinese Tribology Institute of the Chinese Mechanical Engineering Society and co-hosted by Tsinghua University. We are honored to organize the conference in China again, and hope that it will be a wonderful event.

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